Dongguan Junhong Electronic Technology Co., Ltd.

nozzle, Laser tin ball welding, Plate -to -board connector, Ultrasonic welding

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Laser tin ball welding is divided into spray ball welding and planting ball welding, is a new solder solder paste process. The main advantage of this process is that the interconnection can be achieved at a very small size, the size of the droplet can be as small as tens of microns. The tin ball in the container can be transferred to the injection head through a special single-tin bead ball splitting system. Through the high pulse energy of the laser, the tin ball placed on the injection head is instantly melted. Then the inert gas pressure is used to spray the melted tin onto the surface of the solder joint to form a joint solder joint.

It is a new type of welding. Laser tin ball soldering machine for semiconductor devices in thin wall materials, precision parts welding, spot welding, butt welding, overlap welding, sealing welding, high depth to width ratio, welding width is small, heat affected zone is small, small deformation, welding speed, smooth weld, beautiful, no processing or simple processing after welding, welding quality is high, no porosity, accurate control, small focus spot, High positioning accuracy, easy to realize automation.

The tin ball is transported from the tin ball box to the nozzle, and after melting by laser heating, it is ejected from the special nozzle and directly covered to the pad, without additional flux or other tools.

Tin ball jet laser welding system, is the use of laser heating tin ball, and through a certain pressure jet to the need of planting ball bonding position, is a new ball planting technology. It has the advantages of non-contact, no flux, small heat and precise control of brazing metal. Compared with the ordinary planting method, it has the characteristics of impact deformation and instantaneous solidification, which reflects the unique process characteristics. At the same time, the injection speed is fast, which is especially suitable for the chip of the ball grid array package. BGA laser ball planting system adopts multi-axis intelligent working platform, equipped with synchronous CCD positioning system, can effectively plant ball precision and yield. The application range of tin ball is 100um ~ 760um.

Using tin ball jet welding, high welding accuracy, for temperature requirements or soft plate connection welding area. In the whole process, the solder joint and the welding body are not in contact, which solves the electrostatic threat caused by contact in the welding process.

Because the tin ball does not contain flux, laser heating and melting will not cause splash, full and smooth after solidification, there is no follow-up cleaning or surface treatment of additional processes on the welding disc. And the amount of tin is constant, the ball welding speed is fast, high precision, especially suitable for HD camera module and precision voice control devices, data line solder joint assembly and other small plate and enamented wire solder welding. At present, the tin ball laser welding system is mainly used in the 3C electronics industry, which is suitable for the welding of camera module, VCM module, contact bracket, magnetic head and other precision micro components.