Dongguan Junhong Electronic Technology Co., Ltd.

nozzle, Laser tin ball welding, Plate -to -board connector, Ultrasonic welding

Waiting for tungsten steel products!

+86 137-1181-8751

CN
4dhcpmingchen
Board to board connector customization

Board to board connector customization

  • AcceleRate®HD (shown as ADF6/ADM6)

    4-row design with up to 400 total/OS

    0.635mm spacing

  • AcceleRate®HP(shown as APF6/APM6)

    Total I/O up to 800; Roadmap up to 1,000 + 0.635mm pitch

  • AcceleRate® cable (ARC6 shown)

    2-row design with 8, 12 and 24 difference pairs

    0.635mm spacing

  • AcceleRate®HP cable (shown as ARP6)

    A total of 32 to 72 differential pairs (up to 964 pairs on the road map)

    0.635mm interrow spacing; 2.20/2.40mm row spacing

    The highest density 112 Gbps PAM4 cable-to-board system in the industry.

  • The

    AcceleRate ® product family includes 0.635mm pitch board-to-board and cable assemblies, enabling next-generation speeds with incredible density packed into small shapes.

  • AcceleRate®HD- High-density array with up to 240 EdgeRate® terminals in a slender, lightweight design.

  • AcceleRate®HP-112 Gbps PAM4 Extreme performance array with flexible open terminal design.

  • AcceleRate® Cable - the industry's thinnest cable system with direct connection technology that supports 56 Gbps PAM4 speeds.

  • AcceleRate®HP Cable - the industry's highest density 112Gbps PAM4 system for substrate cable applications.

  • Features

    Very high density, I/0 up to 240; I/0 up to 400 under development

    Lightweight type 5 mm stack height

    5mm slim width

    4-row design; 10-60 pin positions per row (total 40-240 pin positions)

    Edge Rate® Terminal System optimized for signal integrity performance

    Support 56 Gbps PAM4 (28 Gbps NRZ) applications

    Tin ball technology, easy processing and automatic alignment

    Other stack heights are under development