Dongguan Junhong Electronic Technology Co., Ltd.

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SAMTEC EQCD Series -SMT Gold plated LCP board to board connectors

SAMTEC EQCD Series -SMT Gold plated LCP board to board connectors

Status Product Specifications Product Type PITCH(mm) Height (mm) Original Part Number Completion number PIN number Packaging method (package gauge drawing) Production line mode L/T MOQ
Mass production SMT Gold LCP High Speed transmission 14G BTB 0.8 Custom wire SAMTEC EQCD Series 40P, 80P, 120P
  • AcceleRate®HD (shown as ADF6/ADM6)

    4-row design with up to 400 total/OS

    0.635mm spacing

  • AcceleRate®HP(shown as APF6/APM6)

    Total I/O up to 800; Roadmap up to 1,000 + 0.635mm pitch

  • AcceleRate® cable (ARC6 shown)

    2-row design with 8, 12 and 24 difference pairs

    0.635mm spacing

  • AcceleRate®HP cable (shown as ARP6)

    A total of 32 to 72 differential pairs (up to 964 pairs on the road map)

    0.635mm interrow spacing; 2.20/2.40mm row spacing

    The highest density 112 Gbps PAM4 cable-to-board system in the industry.

  • The

    AcceleRate ® product family includes 0.635mm pitch board-to-board and cable assemblies, enabling next-generation speeds with incredible density packed into small shapes.

  • AcceleRate®HD- High-density array with up to 240 EdgeRate® terminals in a slender, lightweight design.

  • AcceleRate®HP-112 Gbps PAM4 Extreme performance array with flexible open terminal design.

  • AcceleRate® Cable - the industry's thinnest cable system with direct connection technology that supports 56 Gbps PAM4 speeds.

  • AcceleRate®HP Cable - the industry's highest density 112Gbps PAM4 system for substrate cable applications.

  • Features

    Very high density, I/0 up to 240; I/0 up to 400 under development

    Lightweight type 5 mm stack height

    5mm slim width

    4-row design; 10-60 pin positions per row (total 40-240 pin positions)

    Edge Rate® Terminal System optimized for signal integrity performance

    Support 56 Gbps PAM4 (28 Gbps NRZ) applications

    Tin ball technology, easy processing and automatic alignment

    Other stack heights are under development